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| IA NT Features Applications Lead free as standard RoHS compliant* ESD protection >25 kV Protects up to 6 lines Bidirectional EMI filtering DFN-12 package Cell phones PDAs and notebooks GPS and SMART cards Color LCD display panel *R oH S CO M PL 2FAG-M12R Integrated Passive & Active Devices General Information FOR EACH LINE The 2FAG-M12R device, manufactured using Thin Film on Silicon technology, provides ESD protection for the external ports of portable electronic devices such as cell phones, notebooks and PDAs. The ESD protection provided by the component enables a data port to withstand a minimum 8 KV Contact / 15 KV Air Discharge per the ESD test method specified in IEC 61000-4-2. The device measures 3 mm x 1.4 mm and can be mounted directly onto an FR4 printed circuit board. The device meets typical thermal cycle and bend test specifications without the use of an underfill material. 100 OHM INT1~6 EXT1~6 10 pF 10 pF GND Electrical Characteristics (@ TA = 25 C Unless Otherwise Noted) Parameter Resistance Capacitance @ 2.5 V, 1 MHz Rated Standoff Voltage Breakdown Voltage @ 1 mA Forward Voltage @ 10 mA Leakage Current @ 3 V ESD Protection: IEC 61000-4-2 Contact Discharge Air Discharge Frequency: Attenuation @ 800-3000 MHz Cut-off (50 I/O) Zero Bias DC Power per Resistor fC Symbol R C VWM VBR VF ID 6 0.8 0.1 Min. 80 16 Nom. 100 20 Max. 120 24 5 Unit pF V V V A 8 15 25 35 150 100 kV kV db MHz mW P Thermal Characteristics (@ TA = 25 C Unless Otherwise Noted) Parameter Operating Temperature Range Storage Temperature Range Symbol TJ TSTG Min. -40 -55 Nom. +25 +25 Max. +85 +150 Unit C C *RoHS Directive 2002/95/EC Jan 27 2003, including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 2FAG-M12R Integrated Passive & Active Devices Product Dimensions This device consists of a DFN package. It consists of 12 I/O pins and 1 ground pin and has a flammability rating of UL 94V-0. The package measures 3 mm x 1.4 mm, weighs approximately 0.10 mg and has a 100 % Sn finish termination. 2.95 - 3.10 (0.116 - 0.122) Frequency Response 0 -10 Attenuation (dB) -20 1.35 - 1.45 (0.053 - 0.057) -30 -40 1 0.178 - 0.228 (0.007 - 0.009) 10 100 Frequency (MHz) 1000 10000 0.178 - 0.228 (0.007 - 0.009) 0.77 - 0.84 (0.030 - 0.033) Block Diagram FOR EACH LINE 0.00 - 0.05 (0.00 - 0.002) INT1~6 0.20 - 0.28 (0.008 - 0.011) 1 0.46 - 0.56 (0.018 - 0.022) 6 0.30 - 0.40 (0.012 - 0.016) 100 OHM EXT1~6 10 pF 10 pF 12 0.20 - 0.30 (0.008 - 0.012) 7 0.20 - 0.30 2 PLCS. (0.008 - 0.012) GND Recommended Pad Layout 2.352 (0.093) 0.50 (0.020) 0.351 (0.014) How to Order 2 FAG - M12R Thinfilm Model Micro Leadframe 1.65 (0.065) Number of Pads Packaging Option R = Tape and Reel Packaged 3000 pcs. / 7 reel 0.265 (0.01) 0.479 (0.019) DIMENSIONS = MILLIMETERS (INCHES) *RoHS Directive 2002/95/EC Jan 27 2003, including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 2FAG-M12R Integrated Passive & Active Devices Device Pin Out 1 2 3 4 5 6 Pin 1 2 GROUND Function INT 1 INT 2 INT 3 INT 4 INT 5 INT 6 7 8 9 10 11 12 Function EXT 6 EXT 5 EXT 4 EXT 3 EXT 2 EXT 1 3 4 5 12 11 10 9 8 7 6 Packaging The surface mount product is packaged in a 8 mm x 4 mm Tape and Reel format per EIA-481 standard. TOP SIDE VIEW (INTO COMPONENT POCKET) DIMENSIONS = 0.3 0.05 (.01 .002) 2.0 0.05 (.08 .002) 4.0 0.1 (.16 .004) 1.5 0.1/-0 (.06 .004/-0) DIA. MILLIMETERS (INCHES) 1.75 0.1 (.07 .004) R 0.3 MAX. (0.01) 8.0 0.3 (.31 .01) 3.50 0.05 (.14 .002) 1.6 0.1 (0.063 .004) 4.0 0.1 (.16 .004) R 0.25 TYP. (0.010) 0.90 0.1 (.035 .004) 3.25 0.1 (.128 .004) ORIENTATION OF COMPONENT IN POCKET BACKSIDE FACING UP Reliable Electronic Solutions Asia-Pacific: TEL +886- (0)2 25624117 * FAX +886- (0)2 25624116 Europe: TEL +41-41 768 5555 * FAX +41-41 768 5510 The Americas: TEL +1-951 781-5492 * FAX +1-951 781-5700 www.bourns.com *RoHS Directive 2002/95/EC Jan 27 2003, including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. COPYRIGHT(c) 2005, BOURNS, INC. LITHO IN U.S.A. 2FAG-M12R REV. 12/05 |
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